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Proceedings Paper

Characterization of a new inspection system
Author(s): Jean-Luc Jacquot; Michel Darboux; Bernard Picard; Manouk Kuradjian
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Paper Abstract

This paper presents a fully automated inspection system answering to the growing need of in-process wafer control After a brief description of the mechanical, optical and image processing parts, we sum up our inspection method based on a robust and fast image comparison . One image is obtained directly from the die to inspect through an optical microscope . The other one may be: - the corresponding site on the neighbouring die ( die to die strategy) - areference image extracted from aleamed defect free library ( die to reference strategy) - a synthesized image from the CAD database ( die to database strategy) We give then some results for three functions of this system: - reticlequalification - defect density measurement on patterned wafers - control of die critical sites Defect localisations are memorized, and an interactive reviewing software allows to observe these defects with various optical conditions (magnification, wavelength, focus...).

Paper Details

Date Published: 1 June 1990
PDF: 12 pages
Proc. SPIE 1261, Integrated Circuit Metrology, Inspection, and Process Control IV, (1 June 1990); doi: 10.1117/12.20045
Show Author Affiliations
Jean-Luc Jacquot, CEA/CENG (France)
Michel Darboux, CEA/CENG (France)
Bernard Picard, CEA/CENG (France)
Manouk Kuradjian, CEA/CENG (France)

Published in SPIE Proceedings Vol. 1261:
Integrated Circuit Metrology, Inspection, and Process Control IV
William H. Arnold, Editor(s)

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