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Proceedings Paper

Polish-like facet preparation via dicing for silica integrated optics
Author(s): L. G. Carpenter; H. L. Rogers; C. Holmes; J. C. Gates; P. G. R. Smith
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Paper Abstract

Preparation of high quality facets for low-loss coupling is a significant production issue for integrated photonics, usually requiring time consuming lapping and polishing. Recently, the development of precision dicing saws with diamond impregnated blades has allowed the achievement of optical grade surfaces in optical materials based on dicing alone. In this report we investigate the optimization dicing conditions to achieve optical quality surfaces in a silica-on-silicon planar substrate and show what can be achieved by correct selection of machining parameters.

Paper Details

Date Published: 11 March 2013
PDF: 6 pages
Proc. SPIE 8621, Optical Components and Materials X, 862107 (11 March 2013); doi: 10.1117/12.2004342
Show Author Affiliations
L. G. Carpenter, Univ. of Southampton (United Kingdom)
H. L. Rogers, Univ. of Southampton (United Kingdom)
C. Holmes, Univ. of Southampton (United Kingdom)
J. C. Gates, Univ. of Southampton (United Kingdom)
P. G. R. Smith, Univ. of Southampton (United Kingdom)


Published in SPIE Proceedings Vol. 8621:
Optical Components and Materials X
Michel J. F. Digonnet; Shibin Jiang; J. Christopher Dries, Editor(s)

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