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Proceedings Paper

Progress and challenges in industrial fabrication of wafer-fused VCSELs emitting in the 1310 nm band for high-speed wavelength division multiplexing applications
Author(s): V. Iakovlev; A. Sirbu; Z. Micković; D. Ellafi; G. Suruceanu; A. Mereuta; A. Caliman; E. Kapon
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Paper Abstract

Building coarse wavelength division multiplexing (WDM), 4×10 Gbps VCSEL transmitter modules has the promise for dramatic decreasing power consumption. Over the last years, we have demonstrated continuous improvements of parameters and reliability of wafer fused long-wavelength VCSELs. Progress and challenges in industrial fabrication of wafer-fused VCSELs emitting in the 1310 nm band for high speed WDM applications are reviewed.

Paper Details

Date Published: 13 March 2013
PDF: 7 pages
Proc. SPIE 8639, Vertical-Cavity Surface-Emitting Lasers XVII, 863904 (13 March 2013); doi: 10.1117/12.2003759
Show Author Affiliations
V. Iakovlev, Ecole Polytechnique Fédérale de Lausanne (Switzerland)
Beam Express S.A. (Switzerland)
A. Sirbu, Ecole Polytechnique Fédérale de Lausanne (Switzerland)
Beam Express S.A. (Switzerland)
Z. Micković, Ecole Polytechnique Fédérale de Lausanne (Switzerland)
D. Ellafi, Ecole Polytechnique Fédérale de Lausanne (Switzerland)
G. Suruceanu, Beam Express S.A. (Switzerland)
A. Mereuta, Beam Express S.A. (Switzerland)
A. Caliman, Beam Express S.A. (Switzerland)
E. Kapon, Ecole Polytechnique Fédérale de Lausanne (Switzerland)
Beam Express S.A. (Switzerland)


Published in SPIE Proceedings Vol. 8639:
Vertical-Cavity Surface-Emitting Lasers XVII
Kent D. Choquette; James K. Guenter, Editor(s)

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