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Proceedings Paper

Picosecond laser ablation of transparent materials
Author(s): Simone Russ; Christof Siebert; Urs Eppelt; Claudia Hartmann; Birgit Faißt; Wolfgang Schulz
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Paper Abstract

Processing of thin and ultra-thin glass displays is becoming more important in the fast increasing market of display manufacturing. As conventional technologies such as mechanical scribing followed by manual breaking mostly lead to bad edge quality and thus to a huge amount of reject, other processes like ablation processes [1] with picosecond lasers are getting more and more interesting. However processing with ultrashort pulsed lasers partially leads to unwanted effects which should be understood in a better way by means of intensive basic research. Therefore the ablation mechanism of ultrashort pulses on transparent materials was investigated in this research project. On the one hand the ablation mechanism was analyzed in a simulative way by means of rate equations on the other hand by laboratory experiments.

Paper Details

Date Published: 15 March 2013
PDF: 11 pages
Proc. SPIE 8608, Laser-based Micro- and Nanopackaging and Assembly VII, 86080E (15 March 2013); doi: 10.1117/12.2001991
Show Author Affiliations
Simone Russ, TRUMPF Laser GmbH & Co. KG (Germany)
Christof Siebert, TRUMPF Laser- und Systemtechnik GmbH (Germany)
Urs Eppelt, Fraunhofer-Institut für Lasertechnik (Germany)
Claudia Hartmann, Fraunhofer-Institut für Lasertechnik (Germany)
Birgit Faißt, TRUMPF Laser- und Systemtechnik GmbH (Germany)
Wolfgang Schulz, Fraunhofer-Institut für Lasertechnik (Germany)


Published in SPIE Proceedings Vol. 8608:
Laser-based Micro- and Nanopackaging and Assembly VII
Udo Klotzbach; Yongfeng Lu; Kunihiko Washio, Editor(s)

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