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Proceedings Paper

Laser sintering of gold nanoparticles on a copper substrate toward an alternative to gold plating
Author(s): Akira Watanabe
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Paper Abstract

The laser sintering of gold nanoparticles on a copper substrate was studied to develop an alternative to gold plating. The major problem in the gold coating on a copper substrate using gold nanoparticle ink is that copper atom easily diffuses to the surface through the gold layer and to form an oxide layer during the thermal sintering of gold nanoparticles. The depth profile of elemental composition of laser-sintered gold layer showed that the effective reduction of the diffusion of copper atom through the gold layer is possible because the laser sintering of metal nanoparticles is extremely fast process due to the nano-heater effect caused by the laser excitation of plasmon band.

Paper Details

Date Published: 15 March 2013
PDF: 8 pages
Proc. SPIE 8608, Laser-based Micro- and Nanopackaging and Assembly VII, 86080O (15 March 2013); doi: 10.1117/12.2001848
Show Author Affiliations
Akira Watanabe, Tohoku Univ. (Japan)


Published in SPIE Proceedings Vol. 8608:
Laser-based Micro- and Nanopackaging and Assembly VII
Udo Klotzbach; Yongfeng Lu; Kunihiko Washio, Editor(s)

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