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Proceedings Paper

Agile automated vision
Author(s): Juergen Fandrich; Lorenz A. Schmitt
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Paper Abstract

The microelectronic industry is a protagonist in driving automated vision to new paradigms. Today semiconductor manufacturers use vision systems quite frequently in their fabs in the front-end process. In fact, the process depends on reliable image processing systems. In the back-end process, where ICs are assembled and packaged, today vision systems are only partly used. But in the next years automated vision will become compulsory for the back-end process as well. Vision will be fully integrated into every IC package production machine to increase yields and reduce costs. Modem high-speed material processing requires dedicated and efficient concepts in image processing. But the integration of various equipment in a production plant leads to unifying handling of data flow and interfaces. Only agile vision systems can act with these contradictions: fast, reliable, adaptable, scalable and comprehensive. A powerful hardware platform is a unneglectable requirement for the use of advanced and reliable, but unfortunately computing intensive image processing algorithms. The massively parallel SIMD hardware product LANTERN/VME supplies a powerful platform for existing and new functionality. LANTERN/VME is used with a new optical sensor for IC package lead inspection. This is done in 3D, including horizontal and coplanarity inspection. The appropriate software is designed for lead inspection, alignment and control tasks in IC package production and handling equipment, like Trim&Form, Tape&Reel and Pick&Place machines.

Paper Details

Date Published: 23 November 1994
PDF: 9 pages
Proc. SPIE 2249, Automated 3D and 2D Vision, (23 November 1994); doi: 10.1117/12.196074
Show Author Affiliations
Juergen Fandrich, Kratzer Automatisierung GmbH (Germany)
Lorenz A. Schmitt, Applied Intelligent Systems, Inc. (United States)


Published in SPIE Proceedings Vol. 2249:
Automated 3D and 2D Vision
Rolf-Juergen Ahlers; Donald W. Braggins; Gary W. Kamerman, Editor(s)

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