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Proceedings Paper

National lithography roadmap: wafer requirements in the year 2000
Author(s): Karen H. Brown
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Paper Abstract

This paper sets a framework for those which follow. The National Lithography Roadmap has been enhanced in 1994 to include a systems approach to lithographic requirements. The lithography specifications at the wafer level which will be required in the manufacture of gigabit chips are described with an emphasis on critical dimension tolerances and overlay. These critical needs place stringent requirements on the total system. The National Roadmap is discussed with an emphasis on the interaction between wafer level measurements and the lithographic system requirements necessary to achieve them.

Paper Details

Date Published: 7 December 1994
PDF: 7 pages
Proc. SPIE 2322, 14th Annual BACUS Symposium on Photomask Technology and Management, (7 December 1994); doi: 10.1117/12.195838
Show Author Affiliations
Karen H. Brown, SEMATECH (United States)


Published in SPIE Proceedings Vol. 2322:
14th Annual BACUS Symposium on Photomask Technology and Management
William L. Brodsky; Gilbert V. Shelden, Editor(s)

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