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Proceedings Paper

Photomask cleaning: areas for future focus
Author(s): Rajeev R. Singh
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Paper Abstract

The methods of photomask cleaning used by the mask makers have been derived from the developments in the semiconductor industry. The understanding of the science of wafer cleaning has advanced significantly in the last decade. However, the past requirements for mask makers have not necessitated an in-depth study of the surface phenomena that dictate the mechanisms for particle adhesion and removal. A survey of the understanding developed in the wafer industry was conducted. Applications relevant to mask making have been identified. Based on this study, areas for future investigations in mask cleaning technology have been recommended.

Paper Details

Date Published: 7 December 1994
PDF: 13 pages
Proc. SPIE 2322, 14th Annual BACUS Symposium on Photomask Technology and Management, (7 December 1994); doi: 10.1117/12.195812
Show Author Affiliations
Rajeev R. Singh, SEMATECH (United States)

Published in SPIE Proceedings Vol. 2322:
14th Annual BACUS Symposium on Photomask Technology and Management
William L. Brodsky; Gilbert V. Shelden, Editor(s)

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