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Proceedings Paper

Strain and displacement measurements for microsystems technology
Author(s): Dietmar Vogel; Rolf Kuehnert; Bernd Michel
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Paper Abstract

Two distinguished methods of tracking of natural or artificial surface structures have been utilized for deformation measurements in the microscopic domain. The first method regards classic speckle photography and involves Young's fringes evaluation, the second one bases on a direct cross correlation of structures by digital image processing means. Displacement and strain values are obtained within a regular data point grid automatically. Possible resolution limits for strain values are about 1 (DOT) 10-4. The typical displacement resolution is about 10 nm, but strongly depends on the structure imaging method. In order to use the measurement data together with numerical finite element simulations interfaces have been installed. The usefulness of the applied algorithms to problems in microtechnology is illustrated by a scanning electron microscope analysis of the complex solder deformation on surface mounted devices. Another example of application deals with the measurement of thermal expansion coefficients on adhesives of the electronics industry.

Paper Details

Date Published: 30 November 1994
PDF: 10 pages
Proc. SPIE 2342, Interferometry '94: Photomechanics, (30 November 1994); doi: 10.1117/12.195505
Show Author Affiliations
Dietmar Vogel, Fraunhofer-Einrichtung fuer Zuverlaessigkeit und Mikrointegration Berlin (Germany)
Rolf Kuehnert, Chemnitzer Werkstoffmechanik GmbH (Germany)
Bernd Michel, Fraunhofer-Einrichtung fuer Zuverlaessigkeit und Mikrointegration Berlin (Germany)


Published in SPIE Proceedings Vol. 2342:
Interferometry '94: Photomechanics
Ryszard J. Pryputniewicz; Jacek Stupnicki, Editor(s)

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