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Proceedings Paper

High-speed, low-noise, fine-resolution TDI CCD imagers
Author(s): Savvas G. Chamberlain; William D. Washkurak
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Paper Abstract

It is well demonstrated that the CCD TDI mode of operation provides increased photosensitivity, relative to a linear CCD array, without the sacrifice of spatial resolution. However, in order to utilize the advantages which the TDI mode of operation offers, attention should be given to the CCD TDI design and tradeoffs which exist between the pixel pitch, dead space between pixels in the horizontal direction, high speed, high photosensitivity, high spatial resolution and wide dynamic range. For example, a 2000 pixel ThI with an MTF of 0.5 will have an effective spatial resolution of only 1000 pixels. Other tradeoffs also are present, such as high speed versus power dissipation which exist both in the array and in the on-chip output video amplifier. Further, noise considerations exist at the video on-chip output amplifier. These include high speed which demands high bandwidth, Johnson noise, 1/f noise, reset noise, and output signal charge to voltage sensitivity. In this paper we shall describe the novel approach which we used in the design of a 2048 x 96 TDI CCD imager. We shall show how we addressed successfully these design tradeoffs and issues. Details about the analysis and design of a high speed on-chip output amplifier will also be presented. In addition, we shall explain how the use of buried channel MOSFET's enabled us to address and solve the power dissipation, speed, and noise issues.

Paper Details

Date Published: 1 July 1990
PDF: 11 pages
Proc. SPIE 1242, Charge-Coupled Devices and Solid State Optical Sensors, (1 July 1990); doi: 10.1117/12.19453
Show Author Affiliations
Savvas G. Chamberlain, Dalsa Inc. (Canada)
William D. Washkurak, Dalsa Inc. (Canada)


Published in SPIE Proceedings Vol. 1242:
Charge-Coupled Devices and Solid State Optical Sensors
Morley M. Blouke, Editor(s)

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