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Proceedings Paper

Reconstruction of rectangles from projections: an application to surface-mounted device placement
Author(s): Concettina Guerra; Elias N. Houstis; Anupam Joshi
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Paper Abstract

In this work we consider algorithmic approaches to the placement problem for surface mounted components and present theoretical results on the minimum number of measurements that are needed to reconstruct images of the components and circuit boards. Initial placement of the chip over the mount area may be slightly incorrect. Machine vision has been used to achieve high accuracy in the placement by providing feedback to the controller on the position of the component's leads relative to the soldering pads. Many traditional 2D vision techniques for image registration have been used to address this problem. Here we take a different approach and consider the problem of reconstructing the shape of the component and the circuit board from a set of projections. We assume that the image consists of overlapping rectangles (the leads and pads) that are iso-oriented and provide theoretical results on the minimum number of measurements that are needed to recover the shape. Such theoretical bounds can help in designing efficient methods to solve the problem of aligning the chip leads to the solder pads.

Paper Details

Date Published: 13 October 1994
PDF: 7 pages
Proc. SPIE 2354, Intelligent Robots and Computer Vision XIII: 3D Vision, Product Inspection, and Active Vision, (13 October 1994); doi: 10.1117/12.189081
Show Author Affiliations
Concettina Guerra, Purdue Univ. (United States)
Elias N. Houstis, Purdue Univ. (United States)
Anupam Joshi, Purdue Univ. (United States)


Published in SPIE Proceedings Vol. 2354:
Intelligent Robots and Computer Vision XIII: 3D Vision, Product Inspection, and Active Vision
David P. Casasent, Editor(s)

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