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Proceedings Paper

Microelectronic test structures for feature placement and electrical linewidth metrology
Author(s): Loren W. Linholm; Richard A. Allen; Michael W. Cresswell
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Paper Abstract

This paper presents a critical review of electrical test methods for determining feature placement with total measurement uncertainties below 10 nm and electrical linewidth for sub-half-micrometer design linewidths with measurement precision below 1 nm. Control of feature placement and control of linewidth have been and are expected to continue to be two of the most important challenges required in the manufacturing of advanced microelectronic devices. Traditional methods of measuring these parameters suffer from both measurement speed and equipment expense. Microelectronic test structures are electrical devices that are used to determine selected tool, process, device, material, or circuit parameters by means of electrical tests. They are supported by a variety of commercial test equipment often found in semiconductor manufacturing facilities. They provide low-cost, post-patterning metrology for determining both feature placement and electrical linewidth. Properly characterized test structures and measurement methods provide an economic means of determining the critical parameters needed to develop, control, and operate the next generation of patterning tools.

Paper Details

Date Published: 1 July 1994
PDF: 28 pages
Proc. SPIE 10274, Handbook of Critical Dimension Metrology and Process Control: A Critical Review, 1027407 (1 July 1994); doi: 10.1117/12.187462
Show Author Affiliations
Loren W. Linholm, National Institute of Standards and Technology (United States)
Richard A. Allen, National Institute of Standards and Technology (United States)
Michael W. Cresswell, National Institute of Standards and Technology (United States)


Published in SPIE Proceedings Vol. 10274:
Handbook of Critical Dimension Metrology and Process Control: A Critical Review
Kevin M. Monahan, Editor(s)

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