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Proceedings Paper

Low-cost packaging of high-performance optoelectronic components
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Paper Abstract

Optoelectronic component costs are often dominated by the costs of attaching fiber optic pigtails-especially for the case of single transverse mode devices. We present early results of our program in low-cost packaging. We are employing machine vision controlled automated positioning and silicon microbench technology to reduce the costs of optoelectronic components. Our machine vision approach to automated positioning has already attained a positional accuracy of less that 5 microns in less than 5 minutes; accuracies and times are expected to improve significantly as the development progresses. Complementing the machine vision assembly is our manufacturable approach to silicon microbench technology. We will describe our silicon microbench optoelectronic device packages that incorporate built-in heaters for solder bonding reflow.

Paper Details

Date Published: 28 September 1994
PDF: 5 pages
Proc. SPIE 2290, Fiber Optic Materials and Components, (28 September 1994); doi: 10.1117/12.187433
Show Author Affiliations
Mark E. Lowry, Lawrence Livermore National Lab. (United States)
Shin-Yee Lu, Lawrence Livermore National Lab. (United States)
Michael D. Pocha, Lawrence Livermore National Lab. (United States)
Oliver Ted Strand, Lawrence Livermore National Lab. (United States)


Published in SPIE Proceedings Vol. 2290:
Fiber Optic Materials and Components
Hakan H. Yuce; Dilip K. Paul; Roger A. Greenwell, Editor(s)

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