Share Email Print
cover

Proceedings Paper

Improved PVD TiW manufacturability using advanced chamber shield design
Author(s): Jay N. Sasserath; Ron Yenchik
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

A study was performed to reduce TiW particle contamination in a dc magnetron sputtering system. Significant accomplishments were obtained through simplification of shielding for the process chamber and the use of improved materials of construction. Through the implementation of this enhanced hardware, maintainability benefits were obtained in the areas of shield use (66% reduction), equipment downtime (30% reduction), and maintenance labor (> 3 hours/shield change). In addition to these, overall particle counts were reduced significantly. Lastly, improvements in film uniformity across a wafer were improved by 0.5%, 1 (sigma) , based upon sheet resistivity contour maps.

Paper Details

Date Published: 14 September 1994
PDF: 8 pages
Proc. SPIE 2334, Microelectronics Manufacturability, Yield, and Reliability, (14 September 1994); doi: 10.1117/12.186769
Show Author Affiliations
Jay N. Sasserath, Materials Research Corp. (United States)
Ron Yenchik, Hewlett-Packard Co. (United States)


Published in SPIE Proceedings Vol. 2334:
Microelectronics Manufacturability, Yield, and Reliability
Barbara Vasquez; Hisao Kawasaki, Editor(s)

© SPIE. Terms of Use
Back to Top