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Proceedings Paper

Temperature-cycle-induced chip surface damage in lead-on-chip packages
Author(s): Masazumi Amagai
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Paper Abstract

In lead-on-chip (LOC) packaging technology, the lead fingers are auached directly to the surface of the chip using a double-side adhesive tape. This method of chip attachment naturally leads to concerns about stress on the polyimide coated chip surface. Device failure related to fracture in the passivation layers and the Al-Si metal has been observed in temperature cycle tests. To investigate the effect of material characterization on the surface damage, devices were fabricated with different types of molding compounds, tapes and polyimides. This paper describes the optimum material properties, the assembly process parameters, and the experimental and simulated results of the surface damage. Keywords: surface damage, LOC package, polyimide, tape, mold compound, simulation

Paper Details

Date Published: 14 September 1994
PDF: 8 pages
Proc. SPIE 2334, Microelectronics Manufacturability, Yield, and Reliability, (14 September 1994); doi: 10.1117/12.186765
Show Author Affiliations
Masazumi Amagai, Texas Instruments Japan (Japan)

Published in SPIE Proceedings Vol. 2334:
Microelectronics Manufacturability, Yield, and Reliability
Barbara Vasquez; Hisao Kawasaki, Editor(s)

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