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Proceedings Paper

Methodology for identification of process-induced electrically active defects
Author(s): Loren C. Krott
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Paper Abstract

One commonly used method for identification of defect contributions from different processing steps is micropartitioning. Micropartitioning allows one to evaluate the total number of defects that are added at a single process step or from a series of process steps. One can then perform a pareto analysis of the defect sources to determine the key area(s) in need of defect reduction. In general this methodology works fine, but it does not take into account whether or not the defects are electrically active. By using a similar methodology to micropartitioning, with the addition of an electrical test pattern, it is possible to identify the sources of electrically active defects. This study demonstrates a methodology for identification of the sources of electrically active defects, and compares these results to the results of micropartitioning of process modules using defect detection tools.

Paper Details

Date Published: 14 September 1994
PDF: 10 pages
Proc. SPIE 2334, Microelectronics Manufacturability, Yield, and Reliability, (14 September 1994); doi: 10.1117/12.186752
Show Author Affiliations
Loren C. Krott, National Semiconductor Corp. (United States)


Published in SPIE Proceedings Vol. 2334:
Microelectronics Manufacturability, Yield, and Reliability
Barbara Vasquez; Hisao Kawasaki, Editor(s)

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