Share Email Print
cover

Proceedings Paper

Yield enhancement through monitoring of real-time manufacturing processes
Author(s): Neil Bryan Henis; Michael J. Satterfield; Edward O. Travis; Carol Gelatos
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

One of the major sources of particles today is from processing equipment. As die size continues to shrink, more effort needs to be placed in defect detection and elimination. A defect of 1 - 2 microns in size, while barely noticeable 5 years ago, can now destroy an entire die. Even with redundancy, a metal defect 1 micron in size will result in excess leakage due to an array short. While missing metal may be repairable, metal flakes from sputtering machines, for example, result in nonrepairable die. The objective of this paper is to show how backend defect reduction and yield enhancement can be improved with the use of the newer defect detection tools. We discuss three defect problems at different process levels which were discovered and eliminated with this work. The term `process induced defects per wafer pass' (PIDPWP) is demonstrated.

Paper Details

Date Published: 14 September 1994
PDF: 11 pages
Proc. SPIE 2334, Microelectronics Manufacturability, Yield, and Reliability, (14 September 1994); doi: 10.1117/12.186739
Show Author Affiliations
Neil Bryan Henis, Motorola (United States)
Michael J. Satterfield, Motorola (United States)
Edward O. Travis, Motorola (United States)
Carol Gelatos, Motorola (United States)


Published in SPIE Proceedings Vol. 2334:
Microelectronics Manufacturability, Yield, and Reliability
Barbara Vasquez; Hisao Kawasaki, Editor(s)

© SPIE. Terms of Use
Back to Top