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Proceedings Paper

Optical profilometer featuring multiple virtual styli for the packaging and interconnect environment
Author(s): Royce Clark; Robert H. Flake; Asif Siddique
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Paper Abstract

A prototype optical profilometer providing automated surface profile measurements utilizing multiple virtual styli with micron height resolution has been developed. Measurement applications illustrated in this paper include TAB Inner Lead Bond (ILB) height and planarity, surface curvature of die mounted in ceramic packages, and MCM flipchip substrate post flatness.

Paper Details

Date Published: 14 September 1994
PDF: 12 pages
Proc. SPIE 2337, Optical Characterization Techniques for High-Performance Microelectronic Device Manufacturing, (14 September 1994); doi: 10.1117/12.186651
Show Author Affiliations
Royce Clark, IBM Corp. (United States)
Robert H. Flake, Univ. of Texas/Austin (United States)
Asif Siddique, Univ. of Texas/Austin (United States)


Published in SPIE Proceedings Vol. 2337:
Optical Characterization Techniques for High-Performance Microelectronic Device Manufacturing
Jagdish P. Mathur; John K. Lowell; Ray T. Chen, Editor(s)

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