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Proceedings Paper

TDR-like low-frequency circuit test and characterization system for package and module interconnects utilizing transient thermal signals
Author(s): Robert H. Flake; D. B. Halstadt; Anthony Wong; Greg Pitner; Hosam Alhafez
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Paper Abstract

A measurement system being developed for noncontact, nondestructive evaluation of package and module interconnects will be discussed. The system is capable of detecting interconnect faults in packages and module substrate layers. Low frequency impedance profiles of interconnects are also extracted. The potential advantages of this system over TDR systems result from the utilization of thermal signals obtained with an IR camera. Hence, they are noncontact measurements (requiring no probe fixtures) that are electrically passive and locally isolated even in an intact circuit. The main disadvantage of this testing method is that the interconnect under test must be planner with the traces exposed and visible to the camera. Therefore, in multilayer substrate structures, this method requires the testing to be conducted separately for each layer prior to assembly during substrate manufacture.

Paper Details

Date Published: 14 September 1994
PDF: 9 pages
Proc. SPIE 2337, Optical Characterization Techniques for High-Performance Microelectronic Device Manufacturing, (14 September 1994); doi: 10.1117/12.186649
Show Author Affiliations
Robert H. Flake, Univ. of Texas/Austin (United States)
D. B. Halstadt, Univ. of Texas/Austin (United States)
Anthony Wong, Univ. of Texas/Austin (United States)
Greg Pitner, Univ. of Texas/Austin (United States)
Hosam Alhafez, Univ. of Texas/Austin (United States)


Published in SPIE Proceedings Vol. 2337:
Optical Characterization Techniques for High-Performance Microelectronic Device Manufacturing
Jagdish P. Mathur; John K. Lowell; Ray T. Chen, Editor(s)

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