Share Email Print

Proceedings Paper

Investigation of stress/strain of silicon on insulator using optical second harmonic generation method
Author(s): Yifan Gu; Chun Hu; Li-Jen Cheng; De Yu Zang; Guann-pyng Li
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Optical second harmonic generation (SHG) method has been applied to the investigation of mechanical stress condition of BESOI (bonded and etched-back silicon on insulator) wafers. SHG scanning of SOI wafers show drastic variations, which are explained, in the case of thin film BESOI, by the mechanical stress arising from the bonding of rough surfaces, and, in the case of thick film BESOI wafer, by the presence of polish-induced strain that results from the thinning process of the wafer. SHG rotational dependence was observed for BESOI wafers, and its symmetry preservation indicates essentially sound silicon film quality despite a high level of mechanical stress. Mechanical stress effect on the SHG signal is also demonstrated through externally applied stress on the BESOI wafer. SHG method is shown to be able to characterize mechanical stress of BESOI wafers and may even identify the sources of the stress.

Paper Details

Date Published: 14 September 1994
PDF: 10 pages
Proc. SPIE 2337, Optical Characterization Techniques for High-Performance Microelectronic Device Manufacturing, (14 September 1994); doi: 10.1117/12.186634
Show Author Affiliations
Yifan Gu, Univ. of California/Irvine (United States)
Chun Hu, Univ. of California/Irvine (United States)
Li-Jen Cheng, Jet Propulsion Lab. (United States)
De Yu Zang, MetroLaser (United States)
Guann-pyng Li, Univ. of California/Irvine (United States)

Published in SPIE Proceedings Vol. 2337:
Optical Characterization Techniques for High-Performance Microelectronic Device Manufacturing
Jagdish P. Mathur; John K. Lowell; Ray T. Chen, Editor(s)

© SPIE. Terms of Use
Back to Top