Share Email Print
cover

Proceedings Paper

Issues associated with submicron via formation
Author(s): Kevin C. Brown; Estrella Alarcon
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

The relationship between plasma etch chemistry and via resistance has been investigated. A gas mixture of Ar/CF4/CHF3 yields lower via resistance than Ar/CF4. However, decreasing the overetch of the Ar/CF4 process improves resistance and failure rate. A longer DI water rinse after solvent strip improves via resistance and failure rate by either dissolution of aluminum fluoride, or corrosion of the aluminum under the via lifting out the organometallic polymer. Higher deep UV photostabilization temperature before etch gives a lower via failure rate with tighter distributions. XPS results show that the Ar/CF4 gas chemistry increases sputtering of aluminum out of the vias during overetch, increasing the amount of aluminum fluoride present, which correlates with the worsened via resistance observed.

Paper Details

Date Published: 9 September 1994
PDF: 11 pages
Proc. SPIE 2335, Microelectronics Technology and Process Integration, (9 September 1994); doi: 10.1117/12.186071
Show Author Affiliations
Kevin C. Brown, National Semiconductor Corp. (United States)
Estrella Alarcon, National Semiconductor Corp. (United States)


Published in SPIE Proceedings Vol. 2335:
Microelectronics Technology and Process Integration
Fusen E. Chen; Shyam P. Murarka, Editor(s)

© SPIE. Terms of Use
Back to Top