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Proceedings Paper

Stackable wafer-thin coolers for high-power laser-diode arrays
Author(s): Robert E. Hendron; C. C. Becker; Joseph L. Levy; John E. Jackson
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Paper Abstract

An advanced cooling technique has been developed to remove very high heat flux levels from two-dimensional arrays of GaAs laser diode bars using stackable wafer thin coolers. The thermal performance of these coolers is expected to surpass previous versions, and a unique sealing technique has been designed to allow these coolers to be packaged in a very compact arrangement. The cooler design and fabrication, coolant manifold and sealing, and test procedure are described.

Paper Details

Date Published: 1 May 1990
PDF: 11 pages
Proc. SPIE 1219, Laser Diode Technology and Applications II, (1 May 1990); doi: 10.1117/12.18271
Show Author Affiliations
Robert E. Hendron, McDonnell Douglas Electronic Systems Co. (United States)
C. C. Becker, McDonnell Douglas Electronic Systems Co. (United States)
Joseph L. Levy, McDonnell Douglas Electronic Systems Co. (United States)
John E. Jackson, McDonnell Douglas Electronic Systems Co. (United States)


Published in SPIE Proceedings Vol. 1219:
Laser Diode Technology and Applications II
Dan Botez; Luis Figueroa, Editor(s)

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