Share Email Print
cover

Proceedings Paper

Large-tolerance and low-dispersion optical chip-to-chip interconnects using grating couplers
Author(s): Ming Li; John C.H. Lin; Stephen J. Sheard
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

In this paper, we investigate the possibility of vertically interconnecting waveguides on different substrates using grating couplers. The coupling between waveguides is achieved using a holographic projection scheme. The effects of alignment and fabrication tolerances, as well as the dispersion characteristics, of this structure are considered. Simulation results show that this type of interconnection is surprisingly insensitive to fabrication errors.

Paper Details

Date Published: 5 August 1994
PDF: 5 pages
Proc. SPIE 2321, Second International Conference on Optoelectronic Science and Engineering '94, (5 August 1994); doi: 10.1117/12.182122
Show Author Affiliations
Ming Li, Univ. of Oxford (United Kingdom)
John C.H. Lin, Univ. of Oxford (United Kingdom)
Stephen J. Sheard, Univ. of Oxford (United Kingdom)


Published in SPIE Proceedings Vol. 2321:
Second International Conference on Optoelectronic Science and Engineering '94
Wang Da-Heng; Anna Consortini; James B. Breckinridge, Editor(s)

© SPIE. Terms of Use
Back to Top