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Proceedings Paper

Reactive ion etching (RIE) control by optical emission endpoint detection in IR focal plane array production
Author(s): Glennis J. Orloff
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Paper Abstract

The Microelectronics Manufacturing Science and Technology (MMST) program, a program mutually funded by ARPA, the U.S. Air Force, and Texas Instruments, was recently completed at TI and has had great impact on the fabrication of silicon-based devices. The MMST factory relied heavily on sensors to control processing and increase throughput and yield. It is our intent to utilize this MMST technology for infrared focal plane array (IRFPA) production. Aspects of our program to incorporate MMST technology into IRFPA production are discussed emphasizing the use of automated optical-emission-endpoint detection. Automated optical-emission-endpoint detection was successfully demonstrated on a RIE reactor. Optical emission was used to monitor as well as control our dielectric etch. The operation and application of optical emission endpoint detection for IRFPA fabrication are presented.

Paper Details

Date Published: 13 July 1994
PDF: 8 pages
Proc. SPIE 2228, Producibility of II-VI Materials and Devices, (13 July 1994); doi: 10.1117/12.179672
Show Author Affiliations
Glennis J. Orloff, Texas Instruments Inc. (United States)


Published in SPIE Proceedings Vol. 2228:
Producibility of II-VI Materials and Devices
Herbert K. Pollehn; Raymond S. Balcerak, Editor(s)

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