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Proceedings Paper

Fiber optic MCM for spaceborne applications
Author(s): Julian P. G. Bristow; John A. Lehman; Yue Liu; W. Tim Goldberg; John L. DeRuiter; Dennis Kersch
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Paper Abstract

This paper presents a fiber optic packaging technique using qualifiable materials and processes that has been developed for space applications. The technique is consistent with a Multi Chip Module implementation. This packaging technique allows multiple fiber optic interfaces to be combined with high density electronics within a single easily integrable package and can be used wherever fiber optics are incorporated into spaceborne systems, including the Fiber Optic Data Bus, the Space Station FDDI interface, any upgrades of the Space Station Local Bus from 1553 to 1773, and various Dual Rate 1773 applications.

Paper Details

Date Published: 8 June 1994
PDF: 10 pages
Proc. SPIE 2215, Photonics for Space Environments II, (8 June 1994); doi: 10.1117/12.177630
Show Author Affiliations
Julian P. G. Bristow, Honeywell Technology Ctr. (United States)
John A. Lehman, Honeywell Technology Ctr. (United States)
Yue Liu, Honeywell Technology Ctr. (United States)
W. Tim Goldberg, Honeywell Technology Ctr. (United States)
John L. DeRuiter, Honeywell Satellite Systems Operation (United States)
Dennis Kersch, Honeywell Satellite Systems Operation (United States)


Published in SPIE Proceedings Vol. 2215:
Photonics for Space Environments II
Edward W. Taylor, Editor(s)

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