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Proceedings Paper

High-speed 3D optoelectronic interconnect
Author(s): Freddie Shing-Hong Lin; Cong T. Nguyen; Robert M. Mino; Peterlynn R. Bumacod; Robert L. Kaminski
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Paper Abstract

A demonstration hardware with high-speed, multiple optical data links was built for board-to-board optical interconnect operations. There are two types of optical interconnect paths in this hardware: interboard and backplane interconnects. It was demonstrated that multiple 500/550 MHz signals can be simultaneously transmitted in both the interboard and the backplane configurations.

Paper Details

Date Published: 10 June 1994
PDF: 7 pages
Proc. SPIE 2155, Optoelectronic Signal Processing for Phased-Array Antennas IV, (10 June 1994); doi: 10.1117/12.177416
Show Author Affiliations
Freddie Shing-Hong Lin, Physical Optics Corp. (United States)
Cong T. Nguyen, Physical Optics Corp. (United States)
Robert M. Mino, Physical Optics Corp. (United States)
Peterlynn R. Bumacod, Physical Optics Corp. (United States)
Robert L. Kaminski, Rome Lab. (United States)


Published in SPIE Proceedings Vol. 2155:
Optoelectronic Signal Processing for Phased-Array Antennas IV
Brian M. Hendrickson, Editor(s)

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