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Proceedings Paper

Integrated optoelectronic interconnect for phased-array antenna applications
Author(s): Lawrence J. Lembo; Moshe Sergant; Chan A. Tu; Philip H. Wisseman; Charles Zmudzinski; John C. Brock
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Paper Abstract

An integrated semiconductor interconnect chip is being developed for the distribution of microwave signals to the subarrays and/or radiating elements of a phased array antenna (PAA). The baseline chip design calls for a 1 X 4 distribution fanout, and consists of both waveguide splitters and integrated optical amplifiers to compensate for inherent splitting as well as excess waveguide and coupling losses. Analysis is being performed to evaluate the RF performance of photonic links containing semiconductor optical amplifiers, and to determine the most judicious use of such an interconnect in the photonic feed network of a PAA.

Paper Details

Date Published: 10 June 1994
PDF: 11 pages
Proc. SPIE 2155, Optoelectronic Signal Processing for Phased-Array Antennas IV, (10 June 1994); doi: 10.1117/12.177387
Show Author Affiliations
Lawrence J. Lembo, TRW Research Ctr. (United States)
Moshe Sergant, TRW Research Ctr. (United States)
Chan A. Tu, TRW Research Ctr. (United States)
Philip H. Wisseman, TRW Research Ctr. (United States)
Charles Zmudzinski, TRW Research Ctr. (United States)
John C. Brock, TRW Research Ctr. (United States)


Published in SPIE Proceedings Vol. 2155:
Optoelectronic Signal Processing for Phased-Array Antennas IV
Brian M. Hendrickson, Editor(s)

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