Share Email Print
cover

Proceedings Paper

Microchannel coolers for high-power laser diodes in copper technology
Author(s): Volker K. Krause; Hans-Georg Treusch; Peter Loosen; T. Kimpel; Jens Biesenbach; Arnd Koesters; F. Robert; H. Oestreicher; Marcel Marchiano; Bernhard DeOdorico
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

This paper describes as an alternative to the silicon technology the production, assembly, and performance of microchannel coolers in copper technology. A realization technique for these copper coolers is described for one specific cooler geometry with a stacked design of 5 microstructured copper plates. These 5 layers are bonded together by diffusion welding at a temperature near 800 degree(s)C. This bonding process allows the fabrication of 3 X 8 coolers in one step in which the 5 structured copper plates of a size of 100 X 150 mm2 are bonded together. The structuring procedure is currently done by etching and laser machining. Microchannels with a width of 60 - 100 micrometers and a depth of 300 micrometers are used in the experiments as microstructures for better comparability to already existing theoretical and experimental results. A thermal resistance of 0.44 K/W of these copper coolers is demonstrated for a device with a 10 mm laser diode bar mounted on the front edge of the cooler. Experimental results for this configuration reach an average laser diode power of 71.5 Watts from one single bar with a footprint of 0.6 X 10 mm2. The experimental results are compared to 3-D heat flow calculations.

Paper Details

Date Published: 1 June 1994
PDF: 8 pages
Proc. SPIE 2148, Laser Diode Technology and Applications VI, (1 June 1994); doi: 10.1117/12.176631
Show Author Affiliations
Volker K. Krause, Fraunhofer Institute for Laser Technology (Germany)
Hans-Georg Treusch, Fraunhofer Institute for Laser Technology (United States)
Peter Loosen, Fraunhofer Institute for Laser Technology (Germany)
T. Kimpel, Fraunhofer Institute for Laser Technology (Germany)
Jens Biesenbach, Fraunhofer Institute for Laser Technology (Germany)
Arnd Koesters, Fraunhofer Institute for Laser Technology (Germany)
F. Robert, Fraunhofer Institute for Laser Technology (Germany)
H. Oestreicher, Fraunhofer Institute for Laser Technology (Germany)
Marcel Marchiano, Jenoptik Laserdiode GmbH (Germany)
Bernhard DeOdorico, Jenoptik Laserdiode GmbH (Germany)


Published in SPIE Proceedings Vol. 2148:
Laser Diode Technology and Applications VI
Pei Chuang Chen; Lawrence A. Johnson; Henryk Temkin, Editor(s)

© SPIE. Terms of Use
Back to Top