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Proceedings Paper

Advances in focused ion-beam repair of opaque defects
Author(s): David C. Ferranti; John C. Morgan; William B. Thompson; William C. Joyce
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Paper Abstract

Repair of photomasks by sputter removal of chrome and other opaque materials with a focused ion beam (FIB) of gallium results in the implantation of gallium and chrome ions into the quartz substrate. The effect is localized transmission loss in the regions where material was removed. Currently, these gallium and chrome `stains' are removed using blanket etching techniques of the complete quartz substrate, thereby restoring the transmission losses. However, these techniques are unacceptable for use with phase shift masks (PSMs). This paper describes a technique that was developed to restore the localized transmission losses to acceptable levels in situ at the FIB repair system. In particular, the development of a technique that restores transmission for i-line lithography phase shift masks for 0.50 micrometers and 0.35 micrometers technology requirements is described. Information is presented describing various applications of the process including etched glass and embedded shifter type phase shift photomasks.

Paper Details

Date Published: 13 May 1994
PDF: 13 pages
Proc. SPIE 2194, Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing IV, (13 May 1994); doi: 10.1117/12.175828
Show Author Affiliations
David C. Ferranti, Micrion Corp. (United States)
John C. Morgan, Micrion Corp. (United States)
William B. Thompson, Micrion Corp. (United States)
William C. Joyce, SEMATECH (United States)

Published in SPIE Proceedings Vol. 2194:
Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing IV
David O. Patterson, Editor(s)

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