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Proceedings Paper

Characterization of safe solvent PMMA resist variables for electron-beam application
Author(s): Bruce W. Smith; Todd D. Eakin; Donald W. Johnson
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Paper Abstract

Results are presented from a study undertaken to evaluate resist casting solvent composition and molecular weight variation in PMMA for electron beam exposure. PMMA cast in several solvent systems have been evaluated for lithographic performance. Additionally, formulations in chlorobenzene with minor variations in molecular weight have been evaluated for batch-to- batch uniformity. A 10 KeV MEBES electron beam system has been used to study resist sensitivity, contrast, and process latitude. Using a two-factor, three level factorial designed experiment, prebake and development time have been varied as controlled process factors. Samples with varying molecular weights were shown to have wide process latitude. These samples gave comparable performance while their molecular weights varied from 539 K to 614 K, and polydispersity varied from 3.3 to 6.1. Resist samples with chlorobenzene, PGMEA (propylene glycol monomethyl ether acetate), and anisole as the casting solvent resulted in equivalent performance.

Paper Details

Date Published: 13 May 1994
PDF: 8 pages
Proc. SPIE 2194, Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing IV, (13 May 1994); doi: 10.1117/12.175825
Show Author Affiliations
Bruce W. Smith, Rochester Institute of Technology (United States)
Todd D. Eakin, Rochester Institute of Technology (United States)
Donald W. Johnson, Microlithography Chemical Corp. (United States)


Published in SPIE Proceedings Vol. 2194:
Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing IV
David O. Patterson, Editor(s)

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