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Proceedings Paper

1-kW x-pinch soft x-ray source
Author(s): Steven C. Plidden; M. R. Richter; David A. Hammer; D. H. Kalantar
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Paper Abstract

This paper describes a 1 kW average power soft x-ray source for application to sub-micron lithography. This source will be capable of 1 second resist exposure times, assuming 15 mJ/cm2 resist sensitivity, with feature sizes < 0.18 micron. The source is based on the X-Pinch, a pulsed plasma soft x-ray source which was initially developed at Cornell University for lithography. Experiments have been performed to characterize the radiation emitted from magnesium (Mg) wire X-Pinch plasmas using an 80 ns, < 500 kA pulse. Applied Pulsed Power has designed and is building a 1 kW average power soft x-ray source using the X-Pinch and a 40 pulse/second (pps), 500 kA/pulser. This system is designed to deliver 25 mW/cm2, after the attenuation due to a protective beryllium (Be) foil filter and the lithography mask, to a wafer located 56 cm from the source. This paper summarizes the experimental results and discusses the implications of these test results for microlithography applications. The design of the 1 kW source is described, including the pulser, 40 pps wire array loader, and the debris shielding. Results of initial system testing are presented.

Paper Details

Date Published: 13 May 1994
PDF: 12 pages
Proc. SPIE 2194, Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing IV, (13 May 1994); doi: 10.1117/12.175806
Show Author Affiliations
Steven C. Plidden, Applied Pulsed Power, Inc. (United States)
M. R. Richter, Applied Pulsed Power, Inc. (United States)
David A. Hammer, Applied Pulsed Power, Inc. (United States)
D. H. Kalantar, Applied Pulsed Power, Inc. (United States)


Published in SPIE Proceedings Vol. 2194:
Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing IV
David O. Patterson, Editor(s)

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