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Proceedings Paper

Cost of ownership for x-ray proximity lithography
Author(s): Kathleen Early; William H. Arnold
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Paper Abstract

We present an analysis of the cost of ownership for a synchrotron-based x-ray proximity printing system. We consider the total number of lithography tools that would be needed for a 0.25-micron manufacturing plant with 5000 200-mm wafer starts per week. We compare the cost of x ray with that of deep ultraviolet lithography for patterning critical levels. For reference, we calculate costs for the noncritical levels as well. We examine x ray costs as functions of synchrotron under-utilization, of reticle cost and usage, and of throughput. Our analysis indicates that, under the assumptions of identical process yield and throughput, x-ray system costs with a fully utilized synchrotron are competitive with deep ultraviolet costs if the manufacturing product has high volume. For low or moderate volume products deep ultraviolet lithography is cheaper, predominantly because of lower reticle costs. The lack of a strong economic driver for x ray suggests that it is unlikely to be introduced into manufacturing until it is clear that no optical technology can adequately meet production needs.

Paper Details

Date Published: 13 May 1994
PDF: 12 pages
Proc. SPIE 2194, Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing IV, (13 May 1994); doi: 10.1117/12.175796
Show Author Affiliations
Kathleen Early, Advanced Micro Devices, Inc. (United States)
William H. Arnold, Advanced Micro Devices, Inc. (United States)

Published in SPIE Proceedings Vol. 2194:
Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing IV
David O. Patterson, Editor(s)

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