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Proceedings Paper

Focusing and leveling based on wafer surface profile detection with interferometry for optical lithography
Author(s): Masahiro Watanabe; Yoshitada Oshida; Yasuhiko Nakayama; Minoru Yoshida; Ryuichi Funatsu; Akira Fujii; Taku Ninomiya
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Paper Abstract

A new concept of shot-by-shot leveling for high resolution stepper systems, profile-based- leveling, is presented. This detects the wafer surface profile using laser interferometry. From the detected profile, this system determines where on the LSI chip to focus, and controls the wafer stage for focusing and leveling. With an experimental setup, a profile detection repeatability of +/- 0.02 micrometers , a tilt measurement repeatability of +/- 0.24 (mu) rad and a tilt measurement linearity of +/- 1.4 (mu) rad were obtained.

Paper Details

Date Published: 17 May 1994
PDF: 10 pages
Proc. SPIE 2197, Optical/Laser Microlithography VII, (17 May 1994); doi: 10.1117/12.175490
Show Author Affiliations
Masahiro Watanabe, Hitachi, Ltd. (Japan)
Yoshitada Oshida, Hitachi, Ltd. (Japan)
Yasuhiko Nakayama, Hitachi, Ltd. (Japan)
Minoru Yoshida, Hitachi, Ltd. (Japan)
Ryuichi Funatsu, Hitachi, Ltd. (Japan)
Akira Fujii, Hitachi, Ltd. (Japan)
Taku Ninomiya, Hitachi, Ltd. (Japan)


Published in SPIE Proceedings Vol. 2197:
Optical/Laser Microlithography VII
Timothy A. Brunner, Editor(s)

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