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Proceedings Paper

Analysis of microlithography in an open-architecture TCAD system
Author(s): Valery Axelrad; Victor V. Boksha; Yuri Granik; Ognjen Milic; Juan C. Rey; D. Ward; Eduard I. Tochitsky
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Paper Abstract

The paper offers the results of investigations of forming the submicron topological structures of the `contact window'-type by using only all-dry vacuum and plasmas technologies. Analysis is made of the relationship between lithographic and electric parameters of contact systems with micron-size features. A technological process of manufacturing a three-layer structure `metal-dielectric-metal' by using the LVPL is developed to study electric characteristic of systems with micron and submicron contact windows. Analysis is made of the 0.5 - 1.0 micrometers to 0.5 - 0.3 micrometers . To form masks, use was made of vacuum resist 0.4 to 0.7 micrometers films deposited onto 0.29 micrometers thick silicon oxide layers on a silicon substrate. The resist was subjected to exposure with simultaneous development on a LVPL apparatus. An average of laser radiation power, a pulse repetition rate, a degree of vacuum were maintained constant, while a dose was varied by changing the exposure at E equals 1 J/cm2. Next plasmochemical etching of Al or silicon oxide was performed through a vacuum resist-mask.

Paper Details

Date Published: 17 May 1994
PDF: 12 pages
Proc. SPIE 2197, Optical/Laser Microlithography VII, (17 May 1994); doi: 10.1117/12.175459
Show Author Affiliations
Valery Axelrad, Technology Modeling Associates, Inc. (United States)
Victor V. Boksha, Technology Modeling Associates, Inc. (United States)
Yuri Granik, Technology Modeling Associates, Inc. (United States)
Ognjen Milic, Technology Modeling Associates, Inc. (United States)
Juan C. Rey, Technology Modeling Associates, Inc. (United States)
D. Ward, Technology Modeling Associates, Inc. (United States)
Eduard I. Tochitsky, PLASMOTEG Engineering Ctr. (Belarus)


Published in SPIE Proceedings Vol. 2197:
Optical/Laser Microlithography VII
Timothy A. Brunner, Editor(s)

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