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Proceedings Paper

Process tube characterization method for photoresist and process comparison
Author(s): George P. Mirth; Joseph C. Pellegrini
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Paper Abstract

The behavior of the focus-exposure window for a half micron process was analyzed across a range of resist thicknesses. The range examined was selected to encompass a minima through maxima region of the I-line swing curve. This analysis is shown for an I-line resist; the undyed version contrasted to the dyed. The process tube characterization method calculates the common corridor exposure latitude for the two resist data sets. The common corridor for a given resist system defines that area in the focus-exposure plane that meets a single process specification for all the resist thicknesses in the selected swing curve range. In this study the undyed resist demonstrates a superior process window at a given resist thickness but is found to be inferior to the dyed resist as determined by the process tube characterization method.

Paper Details

Date Published: 16 May 1994
PDF: 7 pages
Proc. SPIE 2195, Advances in Resist Technology and Processing XI, (16 May 1994); doi: 10.1117/12.175399
Show Author Affiliations
George P. Mirth, Shipley Co. Inc. (United States)
Joseph C. Pellegrini, New Vision Systems Inc. (United States)


Published in SPIE Proceedings Vol. 2195:
Advances in Resist Technology and Processing XI
Omkaram Nalamasu, Editor(s)

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