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Proceedings Paper

Dissolution inhibition of phenolic polymers: does a simple percolation field scaling law suffice?
Author(s): Peter Trefonas; Gerald Vizvary; Jonathan C. Root; Catherine C. Meister; Charles R. Szmanda
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Paper Abstract

The universality of a single percolation field scaling law to the tetramethylammonium hydroxide dissolution of derivatized novolac and poly(4-vinylphenol) polymers was investigated. According to this hypothesis, the dissolution of phenolic polymers occurs through a percolative mechanism resulting from the diffusion of base along nascent channels formed by the spatial proximity of phenolic hydroxyl groups (presumably diffusion of the cation is rate limiting). Dissolution inhibition results from the removal of sites from the percolation field. In this study, the polymers were derivatized with increasing amounts of either 2,1,5- diazonaphthoquinone groups or methylsulphonyl ester groups and the dissolution rates of the films were measured. While our experimental data supported adherence to the percolation law (p equals the scaled amount of free hydroxyl sites remaining on the polymer), Rate equals Rate0 (p-pc)t, we did not find that a single exponent of t equals 2 universally described the dissolution behavior. Rather, our data indicated that t varied with different systems, with values of t greater than 5 being observed. These results are explained in terms of multiple simultaneously operant mechanisms of dissolution creating an environment where multiple percolation can occur. The relative shielding effects of the blocking groups are also compared.

Paper Details

Date Published: 16 May 1994
PDF: 18 pages
Proc. SPIE 2195, Advances in Resist Technology and Processing XI, (16 May 1994); doi: 10.1117/12.175384
Show Author Affiliations
Peter Trefonas, Shipley Co. Inc. (United States)
Gerald Vizvary, Shipley Co. Inc. (United States)
Jonathan C. Root, Shipley Co. Inc. (United States)
Catherine C. Meister, Shipley Co. Inc. (United States)
Charles R. Szmanda, Shipley Co. Inc. (United States)


Published in SPIE Proceedings Vol. 2195:
Advances in Resist Technology and Processing XI
Omkaram Nalamasu, Editor(s)

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