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Proceedings Paper

Rearrangement of novolak resins
Author(s): M. Dalil Rahman; Ralph R. Dammel; Dana L. Durham
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Paper Abstract

During the course of investigations into the synthesis of novolak resins for use in the microelectronics industry we have observed the rearrangement of the resin. Deeper investigation of this phenomenon has shown it to be a chain scission which leads to a rearrangement of the novolak structure. A possible mechanism is discussed.

Paper Details

Date Published: 16 May 1994
PDF: 11 pages
Proc. SPIE 2195, Advances in Resist Technology and Processing XI, (16 May 1994); doi: 10.1117/12.175382
Show Author Affiliations
M. Dalil Rahman, Hoechst Celanese Corp. (United States)
Ralph R. Dammel, Hoechst Celanese Corp. (United States)
Dana L. Durham, Hoechst Celanese Corp. (United States)


Published in SPIE Proceedings Vol. 2195:
Advances in Resist Technology and Processing XI
Omkaram Nalamasu, Editor(s)

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