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Proceedings Paper

Role of residual casting solvent in dissolution behavior of poly (3-methyl-4-hydroxystyrene) films
Author(s): Veena Rao; William D. Hinsberg; Curtis W. Frank; Roger Fabian W. Pease
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Paper Abstract

Residual solvent present in resist films following spin casting can significantly influence dissolution behavior. We have used radiolabeling to measure solvent remaining in spin cast films after they have undergone various annealing protocols. Films of poly(3-methyl-4-hydroxystyrene) were found to contain a significant fraction of propylene glycol methyl ether acetate (as much as 50 percent by weight) depending on the annealing conditions. 1100 angstrom films contained a higher percentage of residual solvent than 1.2 micrometers films. A diffusion plus evaporation model was used to deduce the diffusion coefficients of residual solvent as a function of film thickness and annealing temperature. We found that diffusion coefficients of residual solvent in 1100 angstrom polymer films are more than two orders of magnitude less than in 1.2 micrometers thick films.

Paper Details

Date Published: 16 May 1994
PDF: 14 pages
Proc. SPIE 2195, Advances in Resist Technology and Processing XI, (16 May 1994); doi: 10.1117/12.175373
Show Author Affiliations
Veena Rao, Stanford Univ. (United States)
William D. Hinsberg, IBM Almaden Research Ctr. (United States)
Curtis W. Frank, Stanford Univ. (United States)
Roger Fabian W. Pease, Stanford Univ. (United States)

Published in SPIE Proceedings Vol. 2195:
Advances in Resist Technology and Processing XI
Omkaram Nalamasu, Editor(s)

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