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Proceedings Paper

Modeling of solvent evaporation effects for hot plate baking of photoresist
Author(s): Chris A. Mack; David P. DeWitt; Benjamin K. Tsai; Gil Yetter
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Paper Abstract

A heat transfer model for hotplate baking is combined with a mass transfer model for solvent diffusion to predict the major effects of photoresist prebaking for photolithography. Solvent diffusivity as a function of solvent concentration and temperature is determined experimentally. The results of the model are a complete time-temperature history of the wafer, final solvent distribution within the resist film, and final resist thickness.

Paper Details

Date Published: 16 May 1994
PDF: 12 pages
Proc. SPIE 2195, Advances in Resist Technology and Processing XI, (16 May 1994); doi: 10.1117/12.175372
Show Author Affiliations
Chris A. Mack, FINLE Technologies, Inc. (United States)
David P. DeWitt, Purdue Univ. (United States)
Benjamin K. Tsai, Technometrics, Inc. (United States)
Gil Yetter, SEMATECH (United States)


Published in SPIE Proceedings Vol. 2195:
Advances in Resist Technology and Processing XI
Omkaram Nalamasu, Editor(s)

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