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Proceedings Paper

Calculation of film-thickness distribution provided by vacuum-arc deposition
Author(s): Hao Wang; Jiyan Zou; Lei Yang; Li-chun Cheng; Hong Lin Yang
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Paper Abstract

Computer calculation of pure metal film thickness distribution, using vacuum arc deposition technique, is presented in this paper. For random arc with a lower arc current, a model of single cathode spot with ion beam flux taking into account the cosine function spatial distribution is deduced. For arc steered by an external magnetic field, which is parallel to the cathode surface, a multiple cathode spots model is developed. And, in the case of random arc, calculation comparison between static substrate and rotating substrate is made. Results show that film thickness distribution is non-uniform when the arc is not controlled and tends to be uniform when the arc is steered by external parallel magnetic field with cathode geometry and substrate location being well chosen. Also, film thickness distribution is more uniform on a rotating substrate than on a static substrate.

Paper Details

Date Published: 1 May 1994
PDF: 4 pages
Proc. SPIE 2259, XVI International Symposium on Discharges and Electrical Insulation in Vacuum, (1 May 1994); doi: 10.1117/12.174644
Show Author Affiliations
Hao Wang, Huazhong Univ. of Science and Technology (China)
Jiyan Zou, Huazhong Univ. of Science and Technology (China)
Lei Yang, Huazhong Univ. of Science and Technology (China)
Li-chun Cheng, Huazhong Univ. of Science and Technology (China)
Hong Lin Yang, Hunan Univ. (China)


Published in SPIE Proceedings Vol. 2259:
XVI International Symposium on Discharges and Electrical Insulation in Vacuum

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