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Proceedings Paper

Hybrid integration of electrical and optical interconnects
Author(s): Yung-Sheng Liu; Herbert S. Cole; Julian P. G. Bristow; Yue Liu
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Paper Abstract

In this paper, we describe a novel approach for fabrication of low-cost optoelectronic modules for optical interconnect applications. The concept includes: (1) placement of optical and electrical components on a common substrate using a chip-first MCM structure to improve thermal handling capabilities, (2) fabrication of both optical and electrical interconnects using planar processes compatible to standard IC processes in manufacturing to reduce nonrecurring engineering costs, and (3) application of adaptive interconnect for device-to-waveguide alignment to reduce recurring packaging costs. Preliminary results on waveguide fabrication and modeling of adaptive interconnect are discussed in this paper.

Paper Details

Date Published: 2 May 1994
PDF: 7 pages
Proc. SPIE 2153, Optoelectronic Interconnects II, (2 May 1994); doi: 10.1117/12.174526
Show Author Affiliations
Yung-Sheng Liu, GE Corporate Research and Development Ctr. (Taiwan)
Herbert S. Cole, GE Corporate Research and Development Ctr. (United States)
Julian P. G. Bristow, Honeywell Technology Ctr. (United States)
Yue Liu, Honeywell Technology Ctr. (United States)


Published in SPIE Proceedings Vol. 2153:
Optoelectronic Interconnects II
Ray T. Chen; John A. Neff, Editor(s)

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