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Proceedings Paper

FET-SEED-based free-space optical backplanes
Author(s): David V. Plant; Harvard Scott Hinton
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Paper Abstract

Free-space optical interconnects represent a solution to the needs of future connection- intensive digital systems such as ATM switching systems, and massively parallel processing computer systems. These systems require the large board-to-board connectivity provided by an optical backplane created with 2-D arrays of passive, free-space, parallel optical channels (POCs) to optically interconnect the systems electronic printed circuit boards (PCBs) and/or multi-chip modules (MCMs). Such a backplane will be capable of supporting terabit/second aggregate capacities with conductivity levels on the order of 10,000 input/output channels per PCB. Currently, we are developing the optical and optomechanical technology required for demonstrating these terabit capacity free-space optical backplanes. Results to be reported include the optical interconnection of two 4 X 4 FET-SEED transceiver smart pixel arrays, each being mounted on a separate PCB. Optical, electrical, mechanical, and thermal issues are discussed, and extensions of these results to future backplane projects are described.

Paper Details

Date Published: 2 May 1994
PDF: 1 pages
Proc. SPIE 2153, Optoelectronic Interconnects II, (2 May 1994); doi: 10.1117/12.174525
Show Author Affiliations
David V. Plant, McGill Univ. (Canada)
Harvard Scott Hinton, McGill Univ. (United States)


Published in SPIE Proceedings Vol. 2153:
Optoelectronic Interconnects II
Ray T. Chen; John A. Neff, Editor(s)

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