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Proceedings Paper

Generic VLSI platform for system-level optical interconnection insertion
Author(s): Lawrence Anthony Hornak; Stuart K. Tewksbury
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Paper Abstract

A barrier that has faced insertion of optical interconnections within MCM environments is the absence of generic system-level building blocks suitable for inclusion by system designers within prototype MCM architectures. To obtain system-level acceptance, a stable digital interface with built-in self test, fault tolerance, and relaxation of optomechanical alignment must be provided. To accommodate the rapid technology development implied by chip level requirements, these generic components must provide this system-level stability while also acting as a technology platform from which new generations of optical components and integrated packaging can be evaluated. This paper describes design considerations for a prototype intelligent optical interconnection module (IOIM) to serve as this generic system- level building block. The utility of the IOIM organization is motivated through exploration of the requirements of an optoelectronic interface for a cryo-electronic communication switch prototype.

Paper Details

Date Published: 2 May 1994
PDF: 11 pages
Proc. SPIE 2153, Optoelectronic Interconnects II, (2 May 1994); doi: 10.1117/12.174513
Show Author Affiliations
Lawrence Anthony Hornak, West Virginia Univ. (United States)
Stuart K. Tewksbury, West Virginia Univ. (United States)


Published in SPIE Proceedings Vol. 2153:
Optoelectronic Interconnects II
Ray T. Chen; John A. Neff, Editor(s)

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