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Proceedings Paper

Self-alignment by flip-chip bonding for OE-MCM packaging
Author(s): Susant K. Patra; Jian Ma; Volkan H. Ozguz; Sing H. Lee
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Paper Abstract

The impact of process variation associated with lateral and axial misalignment of flip-chip solder joint based assembly for OE-MCM packaging is analyzed through quasi-static force balance in the system. The effect of variation in solder deposition height, vertical loading, and surface tension coefficient on the alignment, and therefore on the optical performance of the system, is studied.

Paper Details

Date Published: 2 May 1994
PDF: 14 pages
Proc. SPIE 2153, Optoelectronic Interconnects II, (2 May 1994); doi: 10.1117/12.174501
Show Author Affiliations
Susant K. Patra, Univ. of California/San Diego (United States)
Jian Ma, Univ. of California/San Diego (United States)
Volkan H. Ozguz, Univ. of California/San Diego (United States)
Sing H. Lee, Univ. of California/San Diego (United States)


Published in SPIE Proceedings Vol. 2153:
Optoelectronic Interconnects II
Ray T. Chen; John A. Neff, Editor(s)

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