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Proceedings Paper

Planar formation of 3D highly parallel optical fan-out interconnects for wafer scale optical clock signal distribution
Author(s): Suning Tang; Ray T. Chen
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Paper Abstract

In this paper, we present a miniaturized compact 3-D optical fan-out interconnect suitable for wafer scale VLSI multichip module optical clock signal distribution. The demonstrated device employs a thin light-guiding substrate in conjunction with a 2-D optical hologram array. The parallel feature among fan-out beams and the planar compact structure convert the unsolvable three spatial and three angular multiple alignment problem into a single-step 2-D planar one, which greatly enhances the packaging reliability. A new design scheme for minimizing throughput power non-uniformity is presented for the first time. A 25 GHz 1-to-42 highly parallel fan-out interconnect was demonstrated with a signal to noise ratio of 10 dB.

Paper Details

Date Published: 2 May 1994
PDF: 8 pages
Proc. SPIE 2153, Optoelectronic Interconnects II, (2 May 1994); doi: 10.1117/12.174495
Show Author Affiliations
Suning Tang, Univ. of Texas/Austin (United States)
Ray T. Chen, Univ. of Texas/Austin (United States)

Published in SPIE Proceedings Vol. 2153:
Optoelectronic Interconnects II
Ray T. Chen; John A. Neff, Editor(s)

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