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Proceedings Paper

"On wafer" measurement of mask-induced overlay error
Author(s): Paolo Canestrari; Giovanni Rivera; C. Lietti
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Paper Abstract

In this paper we present the results of an evaluation into the effects of mask unflatness on the overlay budget. We have investigated two different situations: firstly the case of a single sided telecentric lens and secondly that of a double telecentric one. The results have been determined by measuring this effect directly on wafer.

Paper Details

Date Published: 1 May 1994
PDF: 7 pages
Proc. SPIE 2196, Integrated Circuit Metrology, Inspection, and Process Control VIII, (1 May 1994); doi: 10.1117/12.174161
Show Author Affiliations
Paolo Canestrari, SGS-Thomson Microelectronics (Italy)
Giovanni Rivera, SGS-Thomson Microelectronics (Italy)
C. Lietti, SGS-Thomson Microelectronics (Italy)

Published in SPIE Proceedings Vol. 2196:
Integrated Circuit Metrology, Inspection, and Process Control VIII
Marylyn Hoy Bennett, Editor(s)

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