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Proceedings Paper

Thermal design methodology of hot and chill plates for photolithography
Author(s): David P. DeWitt; T. C. Niemoeller; Chris A. Mack; Gil Yetter
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Paper Abstract

The major requirement for hot- and chill-plate designs is that they provide repeatable and uniform process conditions thereby assuring consistent photoresist quality. A collection of feature-based thermal models has been developed to predict temperature-time histories considering plate construction features including chuck heating/cooling methods, sensor placement with a PID control algorithm, and effects due to vacuum grooves, access holes, support pins and edge-gap. These models can be used by designers and process technologists to assess new approaches, optimize current design and set performance specifications.

Paper Details

Date Published: 1 May 1994
PDF: 17 pages
Proc. SPIE 2196, Integrated Circuit Metrology, Inspection, and Process Control VIII, (1 May 1994); doi: 10.1117/12.174144
Show Author Affiliations
David P. DeWitt, Purdue Univ. (United States)
T. C. Niemoeller, Technometrics, Inc. (United States)
Chris A. Mack, FINLE Technologies, Inc. (United States)
Gil Yetter, SEMATECH (United States)

Published in SPIE Proceedings Vol. 2196:
Integrated Circuit Metrology, Inspection, and Process Control VIII
Marylyn Hoy Bennett, Editor(s)

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