Share Email Print
cover

Proceedings Paper

Resonant integrated micromachined (RIMS) acoustic sensor development
Author(s): Jeffrey N. Schoess; J. David Zook; David W. Burns
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Future advanced fixed- and rotary-wing aircraft, launch vehicles, and spacecraft will incorporate fiber-optic smart sensor networks to monitor structural integrity and manage overall structural health. This paper describes the design of an acoustic emission (AE)-based micromachined sensor for new and aging aircraft applications to assess preflight readiness, in- flight structural integrity, and post-flight time-based maintenance. This unique sensor approach combines silicon micromachining, free-space optical waveguides, high-speed optical interconnects, and supervisory sensor management to measure stress waves related to AE events. A unique second-generation polysilicon resonant microbeam sensor design is described. It incorporates a micron-level vacuum-encapsulated microbeam to optically sense structural-integrity acoustic parameters and to optically excite the sensor pickoff. Its principal of operation, significant payoffs and benefits, and wafer-level laboratory test data results are summarized.

Paper Details

Date Published: 1 May 1994
PDF: 6 pages
Proc. SPIE 2191, Smart Structures and Materials 1994: Smart Sensing, Processing, and Instrumentation, (1 May 1994); doi: 10.1117/12.173956
Show Author Affiliations
Jeffrey N. Schoess, Honeywell Technology Ctr. (United States)
J. David Zook, Honeywell Technology Ctr. (United States)
David W. Burns, Honeywell Technology Ctr. (United States)


Published in SPIE Proceedings Vol. 2191:
Smart Structures and Materials 1994: Smart Sensing, Processing, and Instrumentation
James S. Sirkis, Editor(s)

© SPIE. Terms of Use
Back to Top