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Proceedings Paper

Thinned 4096x4096 CCD mosaic
Author(s): Michael A. Damento; Shun Lo; Hans J. Meyer; Peter E. Doherty; Gary R. Sims; Michael P. Lesser
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Paper Abstract

A thinned-CCD mosaic was fabricated from four Loral 2048 X 2048 edge-buttable CCDs. Thinning was performed on the whole wafer with subsequent dicing and handling facilitated by bonding the thinned wafer to a glass plate. Packaging of the devices involved a `flip-chip' wire-bonding technique followed by chemical dissolution of the glass support. The fabrication process was designed to minimize the gaps between devices and retain a high degree of flatness in the finished CCDs.

Paper Details

Date Published: 1 May 1994
PDF: 5 pages
Proc. SPIE 2172, Charge-Coupled Devices and Solid State Optical Sensors IV, (1 May 1994); doi: 10.1117/12.172760
Show Author Affiliations
Michael A. Damento, Photometrics/Advanced Technologies (United States)
Shun Lo, Photometrics/Advanced Technologies (United States)
Hans J. Meyer, Photometrics/Advanced Technologies (United States)
Peter E. Doherty, Photometrics/Advanced Technologies (United States)
Gary R. Sims, Photometrics/Advanced Technologies (United States)
Michael P. Lesser, Steward Observatory/Univ. of Arizona (United States)


Published in SPIE Proceedings Vol. 2172:
Charge-Coupled Devices and Solid State Optical Sensors IV
Morley M. Blouke, Editor(s)

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