Share Email Print
cover

Proceedings Paper

Reference-based automatic visual inspection of electronic packaging using a parallel image processing system
Author(s): Alan D. Dorundo; Jon R. Mandeville; Frederick Y. Wu
Format Member Price Non-Member Price
PDF $17.00 $21.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

We introduce the Advanced Thin Film Inspection System (ATFIS), a state-of-the-art automatic visual inspection (AVI) system developed by IBM that integrates sophisticated subsystems to inspect advanced multilayer electronic packaging. The image acquisition and 'image segmentation' (material discrimination) is based on a high-radiance illumination, multiband line scan cameras and the Low-level Image Segmentation Architecture (LISA). LISA employs a decision-theoretic approach that classifies pixels according to a decision function defined over a multidimensional 'feature space' (for example, local or global image statistics). The image processing and pattern analysis is based on the Parallel Image Processing System for Inspection (PIPSI) architecture. PIPSI's key features include exploitation of emerging hardware and software technologies; highly programmable to adapt quickly to changing functional requirements; and exploitation of image and operator parallelism, making it highly scalable to meet manufacturing requirements. The pattern analysis algorithm is a synthesis of reference-based comparison and design-rule analysis.

Paper Details

Date Published: 11 March 1994
PDF: 20 pages
Proc. SPIE 2183, Machine Vision Applications in Industrial Inspection II, (11 March 1994); doi: 10.1117/12.171224
Show Author Affiliations
Alan D. Dorundo, IBM Manufacturing Technology Ctr. (United States)
Jon R. Mandeville, IBM Manufacturing Technology Ctr. (United States)
Frederick Y. Wu, IBM Thomas J. Watson Research Ctr. (United States)


Published in SPIE Proceedings Vol. 2183:
Machine Vision Applications in Industrial Inspection II
Benjamin M. Dawson; Stephen S. Wilson; Frederick Y. Wu, Editor(s)

© SPIE. Terms of Use
Back to Top